285 research outputs found

    Assessment of the Thermal Conductivity of BN-C Nanostructures

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    Chemical and structural diversity present in hexagonal boron nitride ((h-BN) and graphene hybrid nanostructures provide new avenues for tuning various properties for their technological applications. In this paper we investigate the variation of thermal conductivity (Îș\kappa) of hybrid graphene/h-BN nanostructures: stripe superlattices and BN (graphene) dots embedded in graphene (BN) are investigated using equilibrium molecular dynamics. To simulate these systems, we have parameterized a Tersoff type interaction potential to reproduce the ab initio energetics of the B-C and N-C bonds for studying the various interfaces that emerge in these hybrid nanostructures. We demonstrate that both the details of the interface, including energetic stability and shape, as well as the spacing of the interfaces in the material exert strong control on the thermal conductivity of these systems. For stripe superlattices, we find that zigzag configured interfaces produce a higher Îș\kappa in the direction parallel to the interface than the armchair configuration, while the perpendicular conductivity is less prone to the details of the interface and is limited by the Îș\kappa of h-BN. Additionally, the embedded dot structures, having mixed zigzag and armchair interfaces, affects the thermal transport properties more strongly than superlattices. Though dot radius appears to have little effect on the magnitude of reduction, we find that dot concentration (50% yielding the greatest reduction) and composition (embedded graphene dots showing larger reduction that h-BN dot) have a significant effect

    Modeling and optimization of Tunnel-FET architectures exploiting carrier gas dimensionality

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    The semiconductor industry, governed by the Moore's law, has achieved the almost unbelievable feat of exponentially increasing performance while lowering the costs for years. The main enabler for this achievement has been the scaling of the CMOS transistor that allowed the manufacturers to pack more and more functionality into the same chip area. However, it is now widely agreed that the happy days of scaling are well over and we are about to reach the physical limits of the CMOS concept. One major, insurmountable limit of CMOS is the so-called thermionic emission limit which dictates that the switching slope of the transistor cannot go below 60mV/dec at room temperature. This makes it impossible to scale down the supply voltage for CMOS transistor without dramatically increasing the static power consumption. To address this issue, a novel transistor concept called Tunnel FET (TFET) which utilizes the quantum mechanical band-to-band tunneling (BTBT) has been proposed. TFETs possess the potential to overcome the thermionic emission limit and therefore allow for low supply voltage operation. This thesis aims at investigating the performance of TFETs with alternative architectures exploiting quantized carrier gases through quantum mechanical simulations. To this end, 1D and 2D self-consistent Schrödinger-Poisson solvers with closed boundaries are developed along with the phonon-assisted and direct BTBT models implemented as a post-processing step. Moreover, we propose an efficient method to incorporate the quantization along the transverse direction which enables us to simulate different dimensionality combinations. The implemented models are calibrated against experimental and more fundamental quantum mechanical simulation methods such as k.p and tight-binding NEGF using tunneling diode structures. Using these tools, we simulate an advanced TFET architecture called electron-hole bilayer TFET (EHBTFET) which exploits BTBT between 2D electron and hole gases electrostatically induced by two separate oppositely biased gates. The subband-to-subband tunneling is first analyzed with the 1D simulator where the device working principle is demonstrated. Then, non-idealities of the EHBTFET operation such as the lateral tunneling and corner effects are investigated using the 2D simulator. The origin of the lateral leakage and techniques to reduce it are analyzed in detail. A parameter space analysis of the EHBTFET is performed by simulating a wide range of channel materials, channel thickness and oxide thicknesses. Our results indicate the possibility of having 2D-2D and 3D-3D tunneling for the EHBTFET, depending on the parameters chosen. A novel digital logic scheme utilizing the independent biasing property of the EHBTFET n- and p-gates is proposed and verified through quantum-corrected TCAD simulations. The performance benchmarking against a 28nm FD-SOI CMOS technology is performed as well. The results indicate that the EHBTFET logic can outperform the CMOS counterpart in the low supply voltage (subthreshold) regime, where it can offer significantly higher drive current due to its steep switching slope. We also compare the different dimensionality cases and highlight important differences between the face and edge tunneling devices in terms of their dependence on the device parameters (channel material, channel thickness and EOT)

    Equilibrium Limit of Boundary Scattering in Carbon Nanostructures: Molecular Dynamics Calculations of Thermal Transport

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    It is widely known that graphene and many of its derivative nanostructures have exceedingly high reported thermal conductivities (up to 4000 W/mK at 300 K). Such attractive thermal properties beg the use of these structures in practical devices; however, to implement these materials while preserving transport quality, the influence of structure on thermal conductivity should be thoroughly understood. For graphene nanostructures, having average phonon mean free paths on the order of one micron, a primary concern is how size influences the potential for heat conduction. To investigate this, we employ a novel technique to evaluate the lattice thermal conductivity from the Green-Kubo relations and equilibrium molecular dynamics in systems where phonon-boundary scattering dominates heat flow. Specifically, the thermal conductivities of graphene nanoribbons and carbon nanotubes are calculated in sizes up to 3 microns, and the relative influence of boundary scattering on thermal transport is determined to be dominant at sizes less than 1 micron, after which the thermal transport largely depends on the quality of the nanostructure interface. The method is also extended to carbon nanostructures (fullerenes) where phonon confinement, as opposed to boundary scattering, dominates, and general trends related to the influence of curvature on thermal transport in these materials are discussed

    The modified post-earthquake damage assessment methodology for TCIP (TCIP-DAM-2020)

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    Chapter 5Post-Earthquake damage assessment has always been one of the major challenges that both engineers and authorities face after disastrous earthquakes all around the world. Considering the number of buildings in need of inspection and the insufficient number of qualified inspectors, the availability of a thorough, quantitative and rapidly applicable damage assessment methodology is vitally important after such events. At the beginning of the new millennia, an assessment system satisfying these needs was developed for the Turkish Catastrophe Insurance Pool (TCIP, known as DASK in Turkey) to evaluate the damages in reinforced concrete (RC) and masonry structures. Since its enforcement, this assessment method has been successfully used after several earthquakes that took place in Turkey, such as 2011 Van Earthquake, 2011 Kutahya Earthquake, 2019 Istanbul Earthquake and 2020 Elazig Earthquake to decide the future of damaged structures to be either ‘repaired’ or ‘demolished’.Scopus - Affiliation ID: 6010507

    A review of selected topics in physics based modeling for tunnel field-effect transistors

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    The research field on tunnel-FETs (TFETs) has been rapidly developing in the last ten years, driven by the quest for a new electronic switch operating at a supply voltage well below 1 V and thus delivering substantial improvements in the energy efficiency of integrated circuits. This paper reviews several aspects related to physics based modeling in TFETs, and shows how the description of these transistors implies a remarkable innovation and poses new challenges compared to conventional MOSFETs. A hierarchy of numerical models exist for TFETs covering a wide range of predictive capabilities and computational complexities. We start by reviewing seminal contributions on direct and indirect band-to-band tunneling (BTBT) modeling in semiconductors, from which most TCAD models have been actually derived. Then we move to the features and limitations of TCAD models themselves and to the discussion of what we define non-self-consistent quantum models, where BTBT is computed with rigorous quantum-mechanical models starting from frozen potential profiles and closed-boundary Schr\uf6dinger equation problems. We will then address models that solve the open-boundary Schr\uf6dinger equation problem, based either on the non-equilibrium Green's function NEGF or on the quantum-transmitting-boundary formalism, and show how the computational burden of these models may vary in a wide range depending on the Hamiltonian employed in the calculations. A specific section is devoted to TFETs based on 2D crystals and van der Waals hetero-structures. The main goal of this paper is to provide the reader with an introduction to the most important physics based models for TFETs, and with a possible guidance to the wide and rapidly developing literature in this exciting research field

    The Electron\u2013Hole Bilayer TFET: Dimensionality Effects and Optimization

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    An extensive parameter analysis is performed on the electron-hole bilayer tunnel field-effect transistor (EHBTFET) using a 1-D effective mass Schr\uf6dinger-Poisson solver with corrections for band non-parabolicity considering thin InAs, In0.53Ga0.47As, Ge, Si0.5Ge0.5, and Si films. It is found that depending on the channel material and channel thickness, the EHBTFET can operate either as a 2-D-2-D or 3-D-3-D tunneling device. InAs offers the highest I ON, whereas for the Si and Si0.5Ge0.5 EHBTFETs, significant current levels cannot be achieved within a reasonable voltage range. The general trends are explained through an analytical model that shows close agreement with the numerical results

    Dental Implants

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    The goal of modern dentistry is to return patients to oral health in a predictable fashion. The partial and complete edentulous patient may be unable to recover normal function, esthetics, comfort, or speech with a traditional removable prosthesis. The patient’s function when wearing a denture may be reduced to one sixth of the level formerly experienced with natural dentition; however, an implant prosthesis may return the function to near-normal limits. The esthetics of the edentulous patient is affected as a result of muscle and bone atrophy. In order to replace a missing tooth, the development of materials science and technology improved the materials for implant application. Nowadays, titanium has become the most popular implant material due to its advantages. The first submerged implant placed by Strock was still functioning 40 years later. Recently, zirconia implants and innovative surface designs are being researched and practiced. In this chapter, these materials will be comparatively discussed through contemporary literature and research
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